Place of Origin : Shenzhen, China
Brand Name : WonDa
Packaging Details : Vacuum bag + Outer carton
Base Material : FR4
Copper Thickness : 1OZ,0.5 to 3.0 oz
Board Thickness : 1.6MM
Min. Hole Size : 0.2MM
Min. Line Width : 0.1MM
Min. Line Spacing : 0.1MM
Surface Finishing : HASL
Solder Mask Color : green/black/white/red/blue
Layer : 1 to 28 layers
Material : FR-4, CEM-1, CEM-3, Hight TG, FR4 halogen free, FR-1, FR-2
Max. Finished Thickness : 0.4 to 7.0mm
Max. Finished Board Side : 500 x 500mm
Surface Finish : HALS/HALS lead free, chemical tin, chemical gold, immersion gold
Hole Tolerance : PTH ±0.076, NTPH ±0.05
Board Type : rigid,flexible,rigid-flexible
Board Shape : rectangular,round,slots,cutouts,complex,irregular
Certification : CE, ROHS, UL
MOQ : None
Price : Negotiable
Delivery Time : 5-15 days
Payment Terms : T/T, W.U, L/C
Supply Ability : 10000 Sq.meter/month
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
1.Detailed Specification of PCB Manufacturing
1 |
layer |
1-18 layer |
|
2 |
Material |
FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2 |
|
3 |
Board thickness |
0.2mm-4mm |
|
4 |
Max.finished board side |
800*508mm |
|
5 |
Min.drilled hole size |
0.25mm |
|
6 |
min.line width |
0.075mm(3mil) |
|
7 |
min.line spacing |
0.075mm(3mil) |
|
8 |
Surface finish/treatment |
HALS/HALS lead free,Chemical tin,Chemical Gold, Immersion gold Immersion Silver/Gold,Osp,Gold Plating |
|
9 |
Copper thickness |
0.5-4.0oz |
|
10 |
Solder mask color |
green/black/white/red/blue/yellow |
|
11 |
Inner packing |
Vacuum packing,Plastic bag |
|
12 |
Outer packing |
standard carton packing |
|
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
|
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,CQC |
|
15 |
profiling punching |
Routing,V-CUT,Beveling |
|
16. providing OEM service to all sorts of printed circuit board assembly |
2.Detailed Terms for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quote requirement:
· Gerber file of the bare PCB board
· BOM (Bill of material) for assembly
· To short the lead time, please kindly advise us if there is any acceptable components substitution.
· Testing Guide & Test Fixtures if necessary
· Programming files & Programming tool if necessary
· Schematic if necessary
OEM/ODM/EMS Services for PCBA:
· PCBA, PCB assembly: SMT & PTH & BGA
· PCBA and enclosure design
· Components sourcing and purchasing
· Quick prototyping
· Plastic injection molding
· Metal sheet stamping
· Final assembly
· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
· Custom clearance for material importing and product exporting
Orientronic PCB assembly Equipment:
· SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
· Reflow Oven: FolunGwin FL-RX860
· Wave Soldering Machine: FolunGwin ADS300
· Automated Optical Inspection (AOI): Aleader ALD-H-350B
· Fully Automatic SMT Stencil Printer: FolunGwin Win-5
1.6MM Thickness FR4 Rigid PCB Board 4 Layer Or 6 Layer multilayer printed circuit board Images |